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PRODID:-//Microsoft Corporation//Outlook MIMEDIR//EN
VERSION:1.0
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DTSTART:20111116T221500Z
DTEND:20111116T230000Z
LOCATION:WSCC 613/614
DESCRIPTION;ENCODING=QUOTED-PRINTABLE:ABSTRACT: There are Standards and Specifications currently under development to define 25Gbps in single channel (SFP+), quad channel (QSFP+) and 10/12 Channel (CXP) form factors for industry applications.  The move from 10Gbps to 25Gbps to provide the increased bandwidth end users are demanding brings numerous challenges with it.  Increased power brings several challenges for systems suppliers.  First is providing the additional power, then comes - how to deal with the additional heat that accompanies the power.=0AThis presentation provides an overview of thermal solutions implemented on current 10Gbps pluggable I/O’s for the form factors noted above along with a snap-shot of activities progressing within various organizations to address the additional cooling requirements.  These organizations include: the Optical Internetworking Forum (OIF), The IEEE 802.3 (4x25), The InfiniBand Trade Association (IBTA) for FDR/14Gbps and EDR/25Gbps (4x25 and 12x25 channel), the CFP and 10x10 MSA’s and the SFF Committee.
SUMMARY:Enhanced Thermal Solutions for 25Gbps Pluggable I/O's
PRIORITY:3
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